Designing an Electrical System for The Characterization of 3D Printed Silicon Layers

system

Members: Coreen Hanna, Niveen Dofash, Zakaria Akkawi

Supervisor: Amir Saar, Niraj Joshi

The precise fabrication and characterization of microscale electronic components are pivotal as electronic devices continue to miniaturize. Laser Induced Forward Transfer (LIFT), a 3D printing technique, offers a promising approach by enabling direct printing of electronic devices directly from their solid phase through laser-induced heat. This project focuses on studying the LIFT for the accurate printing of semiconductor devices in addition to electrically characterizing them by measuring their electrical parameters. These measurements are essential for determining the functionality of the semiconductor devices.

Our project is divided into four key stages: printing silicon layers using LIFT, measuring resistivity with a custom-built 4-probe system, and evaluating mobility and charge carrier density using the Hall effect in advanced laboratory settings. The last part is expanding our project by designing and building an Arduino based digital multimeter (DMM) which is capable of correctly measuring the resistivity of the semiconductor. This involves understanding the measurement and resolution requirements, constructing it using Arduino and ensuring integration with LABVIEW software. We successfully printed silicon devices with a thickness of 3 micrometers and dimensions of 350x350 micrometers, demonstrating the potential of LIFT for creating precise microstructures.

The custom-built 4-probe system allowed for accurate resistivity measurements, while the Hall effect setup provided insights into mobility and charge density. This project holds significant potential for advancing microelectronics by providing reliable methods for printing and characterizing microscale semiconductor devices. Furthermore, the development of an open-source DMM could offer a cost-effective, customizable solution for electronic measurements, benefitting the broader engineering community.